Aluminium base PCB

Laminate：Aluminium
Layer:1
Surface Cu：≥35um
Insulation thickness: 200 um
Thermal Conductivity：6.5 W/mK
Solder resistance:  pass 300℃× 2min
Dielectric data: 7.7（under 1MHz)
Thickness：1.6±0.16mm
Surface treatment：OSP
　
　
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