|
Item |
2012 |
2013 |
2014 |
2015 |
2016 |
|
Layers |
16 |
18 |
20 |
24 |
30 |
|
Max.PCB size |
864mmX610mm |
864mmX610mm |
1016mmX610mm |
1143mmX610mm |
1219mmX610mm |
|
Max.PCB thickness |
3.0mm |
4.0mm |
6.0mm |
8.0mm |
10mm |
|
Min. PCB thickness |
0.4mm |
0.4mm |
0.4mm |
0.4mm |
0.4mm |
|
Min.core thickness |
0.2mm |
0.15mm |
0.1mm |
0.1mm |
0.075mm |
|
Max. Cu thickness |
Inner: 3OZ |
Inner: 5OZ |
Inner: 6OZ |
Inner: 8OZ |
Inner: 10OZ |
|
Outer: 3OZ |
Outer: 5OZ |
Outer: 6OZ |
Outer: 8OZ |
Outer: 10OZ |
|
Min.line W/S |
0.1mm/0.1mm |
0.075mm/0.075mm |
0.075mm/0.075mm |
0.075mm/0.075mm |
0.05mm/0.05mm |
|
Min. CNC drill size |
0.25mm |
0.2mm |
0.15mm |
0.15mm |
0.10mm |
|
Min.laser drill size |
0.10mm |
0.10mm |
0.10mm |
0.075mm |
0.075mm |
|
Aspect ratio |
8:01 |
10:01 |
12:01 |
15:01 |
15:01 |
|
Impedance tol |
±10% |
±10% |
±5% |
±5% |
±5% |
|
HDI capability |
Prototype |
Prototype |
2+N+2 |
3+N+3 |
4+N+4 |
|
Heat sink |
Mass production |
Mass production |
Mass production |
Mass production |
Mass production |
|
Rigid-flex PCB |
/ |
Prototype |
Prototype |
Mass production |
Mass production |
|
Buried capacitance |
/ |
Prototype |
Prototype |
Mass production |
Mass production |
|
Buried resistance |
/ |
/ |
Prototype |
Prototype |
Small volume |
|
IC substracte |
/ |
/ |
Prototype |
Prototype |
Small volume |
|
