| No. |
Process |
Equipment |
No. |
Process |
Equipment |
| 1 |
Engineering preparation |
CAD system |
8 |
SM, CM |
Pumice griding |
| Laser plotter |
Screen printing |
| Film developper |
DS exposure |
| 2 |
Board cutting |
Board cutter |
SM exposure |
| Griding machine |
9 |
Surface treatment |
Ni/Au plating line |
| Board clean |
Ni/Au immersion line |
| 3 |
Inner image transfer |
Inner chemical
clean |
Tin immersion
;line |
| Dry film laminate |
HAL line |
| Parallel exposure |
O.S.P（Entek） |
| Inner DES |
10 |
Fabrication |
CNC routing |
| Inner AOI |
CNC V-CUT |
| 4 |
Lamination |
Horizontal
brown oxide |
11 |
E-test |
fly probe
tester |
| Vacuum pressure |
General tester |
| X-ray target drill |
Special tester |
| 5 |
Drilling |
CNC drill
system |
Vacuum
packageing |
| 6 |
PTH, plating |
PTH line |
12 |
Chemical/physical test |
Impedance
tester |
| Panel plating |
X-Ray thickness tester |
| 7 |
Outer image transfer |
Film laminate |
Microscope |
| Parallel exposure |
Ion tester |
| Pattern plating |
Peel strength tester |
| DES line |
Copper thickness tester |
| Chemical analysis system |
|
